Laser Processing

Laser processing has become increasingly popular because its general ability to yield a better quality product with high repeatability and precision. Its versatility makes it ideal for many high-precision micromachining applications such as laser ablation, welding, cutting, and drilling. Also, laser processing often yields results where other technologies fail due to it's delicate and controlled approach. 

​

There are thousands of various laser applications, here some popular industry examples:

​

• Medical device manufacturing (cutting, drilling, skiving, marking, welding)

• Solar panel processing (welding, cutting, scribing, drilling)

• Semiconductor processing (thin film removal, VIA hole drilling, wafer dicing, trim, etching, ablation)

• Similar and dissimilar metal welding (many various welding technologies available)

• Glass hermetic welding (glass-to-glass, glass-to-metal)

• Glass processing (welding, cutting, scribing, marking, etching, chamfering)

• Polymer thin film processing (thin film removal, selective ablation, cutting)

• Laser trim of electrical components (ablation, selective removal, cleaning, trim)

• Laser thin film removal (display patterning, roll-to-roll patterning, etching, cleaning)

• Display glass processing (cutting, drilling, chamfering, dicing)

• Selective etching of glass (ultrafast laser based selective etching)

• Battery welding (dissimilar metal welding, tab welding, foil welding)

• Battery processing (cleaning, notching, foil cutting, selective ablation)

• Electronics tuning (ablative based trimming of various electrical components)

• Hydrophobic or hydrophilic surface texturing (nanosecond and ultrafast based processes)

• Wafer marking (variety of laser methods for wafer marking)

• Multi-process (combinations of the above processes into a single tool)

​